【英文标准名称】:Semiconductordevices-Part10:Genericspecificationfordiscretedevicesandintegratedcircuits;Amendment3
【原文标准名称】:半导体器件第10部分:分立器件和集成电路总规范修改3
【标准号】:IEC60747-10AMD3-1996
【标准状态】:现行
【国别】:国际
【发布日期】:1996-08
【实施或试行日期】:
【发布单位】:国际电工委员会(IEC)
【起草单位】:IEC/TC47
【标准类型】:()
【标准水平】:()
【中文主题词】:电子工程;规范;电子设备及元件;总规范;集成电路;半导体器件;分立器件
【英文主题词】:specification;semiconductordevices;electronicequipmentandcomponents;discretedevices;electronicengineering;genericspecification;integratedcircuits
【摘要】:Replacestheclauses3.11.8,3.11.8.1and3.8.11.2.Addsannewclause4.2andrenumberstheclauses4.2to4.4as4.3to4.5,respectively.AddsanewannexD.
【中国标准分类号】:L56
【国际标准分类号】:31_080_01
【页数】:7P;A4
【正文语种】:英语


MIL-HDBK-702, MILITARY STANDARDIZATION HANDBOOK: ENGINEERING PRACTICES - PRODUCTIVITY ENHANCEMENT OF INDUSTRIAL PLANT EQUIPMENT AND PRODUCTION SUPPORT SYSTEMS (1 AUG 1985)., The industrial base activities within the DoD are challenged to improve the productivity of manufacturing in support of DoD maintenance of research and develpment.